Industry Analysis
SK Hynix retains its lead in the global HBM market, yet Samsung Electronics is rapidly closing the gap, increasing its share to 33% in Q2, signaling intensified competition in high-bandwidth memory. HBM3E dominates current revenue, with HBM4 expected to ramp in the second half of the year, driven by AI and HPC demand. As Samsung scales HBM4 production, supply chain risks and geopolitical sensitivities—particularly in Taiwan and Hong Kong—will increasingly impact operational costs and manufacturing stability. The competitive landscape is shifting toward technological differentiation and process leadership, with top-tier players investing heavily to secure market dominance. In the next 12 to 18 months, HBM will be shaped by advanced process adoption and strategic capacity expansion, pushing mid-tier foundries to accelerate their transition to cutting-edge nodes.
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