Industry Analysis
The surge in SiC adoption for AI server power supplies is triggering a vertical tech-stack overhaul. Upstream, the shift from 6-inch to 8-inch wafers accelerates; midstream, IDMs and foundries scramble for dual allocation between EVs and data centers; downstream, thermal architectures in PSU designs are being rewritten. Tighter EU efficiency mandates and U.S. IRA incentives raise compliance costs for silicon-based solutions, forcing ODMs to switch earlierโbut yield gaps in SiC substrates between Taiwan, China and mainland China remain a critical supply risk. Wolfspeed and Infineon have locked in long-term deals with hyperscalers, while ON Semi and ROHM bet on integrated modules to bypass foundry constraints. Over the next 18 months, SiC device prices will drop over 15% annually, pushing penetration above 40% in >2kW AI PSUs and squeezing GaN into mid-to-low power niches.
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