Samsung, SK Hynix eye 2028 High-NA DRAM rollout

SK Hynix's move toward high-numerical aperture EUV in 2028 signals a major shift in DRAM manufacturing. This advancement will drive upstream supply chains—especially in photoresist, mask materials, and equipment—toward higher performance standards. The technological leap will compress mid-tier production capacity and accelerate industry consolidation. From a compliance standpoint, this initiative may prompt stricter U.S. export controls on semiconductor technologies, raising operational costs for global players. Competitors like Micron and Kioxia may respond with accelerated R&D investments or strategic acquisitions. In the longer term, 2028 marks a pivotal moment for global DRAM capacity realignment, especially amid deepening U.S.-China tech decoupling. As China Taiwan/ Taiwan, China and South Korean firms navigate complex geopolitical dynamics, this development could redefine the global DRAM landscape, pushing advanced nodes toward 12-inch wafers.