Industry Analysis
Samsung and SK Hynix’s $590 billion bet isn’t ambition—it’s a defensive reflex to AI’s memory-hungry architecture. The HBM surge doesn’t just strain DRAM fabs; it forces convergence of EUV lithography and advanced 3D packaging, benefiting ASML while reshaping NVIDIA’s supply leverage. Seoul’s state-backed 'Three Mega Projects' boost cluster resilience but inflate compliance costs amid tightening U.S.-Korea export controls on advanced tools. Micron will likely accelerate its Japan and U.S. capacity shifts to hedge geopolitical exposure, while packaging firms in Taiwan, China may seize opportunities in HBM interposers. If AI data center capex slows within 18 months, the 2027产能 wave could trigger a price crash—echoing the 2018 memory glut that wiped out weaker players.
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