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Samsung’s Advantage Over TSMC As A Foundry Rival Expands Beyond The 2nm Process, Helping It Ink Multi-Billion-Dollar Agreements; Has Potential To Outgrow Its Competitor - Wccftech

wccftech.com 2026-07-25 Wccftech
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Technologies:2nmGAAHBM4HBM4EEUl
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Semiconductor ManufacturingFoundryTSMCSamsungAI Chips2nm ProcessHBM4 MemoryBroadcomMemorySupply Chain IntegrationAdvanced PackagingChip Design
News Summary
In the increasingly competitive semiconductor industry, Samsung is narrowing the gap with TSMC, the global leader in foundry services, by leveraging its dual strengths in advanced process nodes and me... Read original →
Industry Analysis
Samsung's advancement in 2nm and GAA technologies is reshaping the semiconductor manufacturing landscape. Its multi-billion-dollar deal with Broadcom underscores a full-stack advantage combining chip design, manufacturing, and memory integration—something TSMC’s pure-play model struggles to match in AI infrastructure applications. Unlike TSMC, which currently contributes around 3% of its 2026 Q3 revenue from 2nm, Samsung’s integrated approach enables faster time-to-market and better thermal/power optimization. With NVIDIA and others ramping up AI chip demand, Samsung’s strategic positioning in both advanced nodes and HBM4 memory positions it to outpace competitors. However, geopolitical tensions, especially under U.S. export controls affecting Taiwan, China, pose supply chain risks. In the next 12 months, if Samsung maintains strong customer ties, its lead in high-end manufacturing will likely widen, forcing TSMC to reconsider capacity allocation and strategic partnerships.
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