Samsung reportedly taps TSMC for custom HBM base dies as new foundry dynamics emerge

The supply chain for high-bandwidth memory (HBM) base dies is undergoing a fundamental shift. Samsung’s move to collaborate with TSMC signals a strategic balancing act between in-house development and external manufacturing, while TSMC strengthens its foothold in advanced storage chip production. This development intensifies upstream competition, especially in advanced nodes, where TSMC and Samsung’s rivalry will deepen. From a compliance perspective, geopolitical tensions are pushing companies toward supply chain diversification, yet technical barriers and capacity constraints hinder easy substitution. The strategic adjustments by industry leaders like Micron and SK Hynix indicate a transition from single-source to multi-sourced models. Over the next 12 months, HBM base chip capacity allocation and pricing will be key market drivers. TSMC’s ability to secure top-tier customer orders will define its dominance in global storage chip manufacturing.