Samsung Electronics’ Q2 HBM market share jumps to 33% - 매일경제

In Q2 2024, Samsung Electronics significantly increased its share in the global high-bandwidth memory (HBM) market to 33%, up 12 percentage points from the previous quarter, narrowing the gap with mar... Read original →

Samsung Electronics’ HBM market share surged to 33% in Q2, signaling a rapid rise in its competitive positioning within the high-bandwidth memory segment. Technologically, while HBM3E dominates current revenue, the upcoming HBM4 ramp-up will reshape the entire supply chain, from wafer fabrication to system integration. This shift intensifies demand for advanced packaging and silicon technologies, particularly in AI and data center applications. From a geopolitical standpoint, supply chain vulnerabilities in Taiwan and Hong Kong, China, pose operational risks due to increasing trade restrictions. SK Hynix retains its lead but faces mounting pressure from Samsung’s aggressive expansion. In the next 12–24 months, the HBM market will likely see a convergence of technological transition and capacity expansion, with Samsung’s ability to deliver HBM4 consistently determining its long-term market influence.