Samsung Elec's chip chief says discussed next-generation foundry, HBM cooperation with Nvidia CEO - TradingView

Samsung Electronics' chip chief recently met with NVIDIA CEO Jensen Huang to discuss potential collaboration in next-generation foundry technologies and high-bandwidth memory (HBM). This meeting under... Read original →

Samsung’s high-level talks with NVIDIA on HBM and next-gen foundry signify a strategic tech entanglement driven by AI compute arms race. This accelerates HBM4 and CoWoS-like packaging ecosystems, pressuring SK Hynix and TSMC to enhance heterogeneous integration while spurring Micron to ramp HBM output. Amid U.S.-EU push for semiconductor localization, deeper Samsung-NVIDIA collaboration could trigger tighter U.S. export controls on Korean advanced nodes like GAA and sub-1.4nm. TSMC may counter with aggressive HBM3E bundling to lock in NVIDIA, while mainland China fabs like SMIC remain excluded due to equipment restrictions. Over the next 18 months, co-design of HBM-DRAM and logic dies will define AI chip performance leadership—Samsung’s vertical integration could disrupt TSMC’s dominance if executed decisively.