Samsung and SK Hynix rush to expand capacity as AI memory demand soars

Samsung and SK Hynix aren't merely scaling capacity—they're betting their futures on the HBM generational leap. This move forces upstream suppliers to accelerate EUV adoption, TSV packaging, and thermal interface materials, while compelling GPU designers to rethink memory bandwidth architectures. U.S. export controls temporarily shield Korean market share but inflate global compliance overhead and risk catalyzing China’s HBM alternatives. With Micron leveraging CHIPS Act subsidies to ramp output, Korean firms are burning cash to buy time—but if AI server demand softens, a 2027 glut looms. The next 18 months hinge on HBM4 standardization; only those mastering CoWoS or Foveros heterogeneous integration will lock in premium long-term contracts.