Rising demand for CPO, SiPh reshapes semiconductor testing

The shift of chip testing from final inspection to early-stage development and production is fundamentally reshaping the semiconductor supply chain. As CPO and SiPh technologies gain traction, testing has moved upstream, forcing equipment vendors like Kepos and Huafeng to rapidly evolve their test methodologies. This transition intensifies the pressure on foundries to optimize yield control, while downstream clients such as NVIDIA and AMD demand stricter test protocols, reducing supply chain tolerance. Geopolitical tensions further elevate the strategic importance of localized testing capabilities, especially in key regions like Taiwan and Hong Kong, where self-reliance in test infrastructure is becoming critical. In the next 12–24 months, the industry will see increased focus on customized and intelligent testing solutions, with data traceability and standardization emerging as core industry norms.