Podcast highlights: SoIC vs CoWoS, HBM5 hybrid bonding, and EMIB-T's yield problem

The rise of hybrid bonding technology is reshaping the advanced packaging landscape, with potential to become a key driver in the 2027–2028 capacity expansion phase. This advancement will significantly boost integration efficiency for HBM5 and other high-bandwidth memory solutions, pushing SoIC and CoWoS to evolve in parallel. Upstream wafer fabrication facilities must adjust process nodes to accommodate finer bonding techniques, while downstream packaging and testing firms face dual pressures of capital investment and yield optimization. Geopolitically, the supply chain position of China Taiwan/ Taiwan, China is increasingly critical; stricter U.S. export controls on semiconductor equipment could directly impact operational costs. Competitors may accelerate local production investments to mitigate supply chain risks. Within the next 12 months, unresolved yield issues in EMIB-T could delay high-end packaging deliveries, forcing manufacturers to seek alternative solutions and intensifying long-term technology path dependencies.