Pat Gelsinger joins xLight in bid to bring TSMC into US-made lithography project

Pat Gelsinger’s involvement with xLight signals a direct challenge to ASML’s dominance in EUV lithography, intensifying U.S. efforts to secure its advanced chip manufacturing supply chain. This move accelerates the reshoring of critical photonic equipment, compelling ASML to navigate tighter export controls. The ripple effect will reshape global supplier dynamics, particularly impacting fabs in Taiwan, China, and Hong Kong, China, which face heightened supply chain risks. Companies must brace for increased compliance costs and potential technology blockades. In response, major players like NVIDIA and AMD may pivot toward in-house development or alternative lithography routes. Over the next 12–24 months, the U.S. is likely to consolidate domestic capabilities through strategic policy and investment, aiming to reduce reliance on foreign technology and establish self-sufficient advanced manufacturing ecosystems.