Industry Analysis
onsemi’s Elite Pairing Studio shifts SiC MOSFET and gate driver co-design from empirical guesswork to data-driven optimization, compressing power electronics development cycles. This forces foundries to standardize PDKs upstream and reduces industrial/EV customers’ reliance on generic TI or ADI solutions downstream. Embedded PLECS simulation and EUCL-compliant logic mitigate export control risks, lowering supply chain validation costs amid tightening geo-tech policies. TI will likely counter by integrating 3nm GaN into its WEBENCH platform, while ADI may accelerate digital power IP acquisitions. Within 18 months, cloud-based design tools will become table stakes—second-tier players lacking system-level modeling capabilities will be squeezed out of high-end markets.
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