Industry Analysis
Jensen Huang’s remark at COMPUTEX 2026 that AI is “insanely profitable” for TSMC exposes a self-reinforcing loop: cutting-edge nodes like 3nm and 2nm, enabled by high-NA EUV, are now the bottleneck for AI accelerator performance. TSMC’s exclusive control over this ramp gives it de facto pricing power, squeezing Samsung and Intel’s catch-up timelines. While its Arizona fab eases geopolitical risk, U.S. export controls and talent restrictions inflate operational costs by over 15%. Samsung may resort to aggressive pricing for mid-tier AI chips, but yield issues cap its threat. Over the next 18 months, as CoWoS advanced packaging capacity doubles and 2nm scales, TSMC will evolve from a foundry into an AI infrastructure backbone—justifying its premium valuation through structural tech dominance, not cyclical demand.
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