Nvidia Bets on Everyone as the Entire HBM "Big Three" Secures Vera Rubin Certification - XTB.com

NVIDIA has officially confirmed that HBM4 memory chips from SK hynix, Samsung, and Micron have been certified for its upcoming Vera Rubin platform. This development is not only a significant win for m... Read original →

NVIDIA’s simultaneous certification of HBM4 from SK hynix, Samsung, and Micron signals a strategic pivot toward de-risked scale-up, not just component validation. Technically, the shift to 3nm HBM4 with increased EUV layers will accelerate adoption of advanced TSV and hybrid bonding, boosting demand for ASML and Applied Materials tools. On compliance, multi-sourcing mitigates exposure to U.S. export controls and reduces overreliance on packaging capacity in Taiwan, China. Intel faces mounting pressure—if its Foveros-based HBM integration isn’t cost-competitive by 2027, Gaudi’s market share will erode further. Enterprise software firms like SAP may redesign memory-intensive AI workloads accordingly. Over the next 18 months, the HBM supply chain will evolve from winner-takes-all to tiered coexistence, opening doors for second-tier OSATs and domestic EDA vendors—though Micron’s yield ramp remains its critical bottleneck to sustained high-end relevance.