Industry Analysis
The KOSPI flash crash reveals acute market sensitivity to memory leaders’ profit expectations. Despite Samsung’s stellar Q2, DRAM pricing—peaking in late 2025—has softened for two consecutive quarters amid slower AI server procurement, triggering aggressive profit-taking. Technically, delayed HBM3E ramp-up is constraining CoWoS advanced packaging ecosystems, indirectly throttling NVIDIA’s next-gen GPU deployment. On compliance, U.S.-ROK supply chain de-risking policies are inflating operational costs at SK Hynix’s Wuxi and Samsung’s Xi’an fabs. Micron may leverage this volatility to expand subsidized capacity in Japan and India, while Western Digital could accelerate its exit from legacy NAND to focus on enterprise SSDs. Over the next 12–24 months, a brutal shakeout looms: second-tier players without HBM capabilities will retreat from premium segments, while vertically integrated IDMs with heterogeneous integration prowess will seize pricing dominance.
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