Industry Analysis
Insatiable AI data center demand for HBM has pushed the DRAM/NAND supply chain to a breaking point. Micron’s surge stems from its 1β-node yield leadership and HBM3E ramp, but this advantage is fleeting—Samsung and SK Hynix are aggressively expanding CoWoS packaging capacity and will likely overtake via heterogeneous integration by 2027. Apple’s price hikes reveal its weak bargaining power in memory procurement, exposing a critical gap in vertical integration. Geopolitically, U.S. CHIPS Act subsidies are distorting global capacity allocation, forcing firms to allocate at least 30% of capex to redundant domestic fabs, inflating costs. Over the next 18 months, CXL-based memory pooling will disrupt traditional module economics, while Russell index rebalancing may amplify cyclical volatility through passive flows unrelated to fundamentals.
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