Industry Analysis
Micron’s HBM4 ramp is triggering a cascade across the AI hardware stack: upstream equipment vendors like Applied Materials are prioritizing its EUV layer capacity, while downstream GPU makers accelerate packaging co-design. Although U.S. CHIPS Act subsidies ease CapEx burdens, reliance on suppliers in Taiwan, China and Korea—especially for TSV interconnects—remains a critical choke point. With Samsung and SK Hynix aggressively boosting HBM4 yields, Micron must lock in customer pre-commitments to avoid a repeat of the 2018 price collapse. Over the next 18 months, soaring demand from AI training clusters will lift DRAM ASPs, but if CoWoS packaging bottlenecks ease, HBM premiums could compress rapidly—leaving only vertically integrated players with sustainable margins.
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