Micron forecasts $100B HBM market in 2027 amid AI surge - MSN

Micron Technology has forecast that the high-bandwidth memory (HBM) market will reach $100 billion by 2027, driven by the rapid expansion of artificial intelligence (AI). As AI models grow in complexi... Read original →

Micron’s $100B HBM forecast by 2027 reflects the AI compute arms race spilling into memory architecture. Technically, HBM’s 3D stacking is forcing upgrades in TSV, hybrid bonding, and thermal interface materials—upstream suppliers gain first-mover advantage while GPU designs adapt to bandwidth saturation. On compliance, U.S. export controls now cover HBM3E, compelling dual-supply chains that inflate operational costs by over 15%. In market dynamics, Samsung and SK Hynix are fast-tracking HBM4, while TSMC in Taiwan, China locks in NVIDIA via CoWoS capacity, creating a foundry-designer moat. Over the next 12–24 months, HBM will become the de facto performance gatekeeper for AI chips; non-HBM solutions face obsolescence, and mid-tier foundries will scramble for entry-level HBM share—accelerating industry consolidation.