Meet He Tingbo: Huawei’s ‘chip queen’ trying to rewrite China’s semiconductor playbook - South China Morning Post

At the IEEE International Symposium on Circuits and Systems in Shanghai on May 27, 2026, He Tingbo, a senior executive at Huawei Technologies, unveiled the company’s new 'Tau (τ) Scaling Law' framewor... Read original →

He Tingbo’s Tau Scaling Law signals China’s strategic pivot from 'chasing Moore' to 'transcending Moore.' Technically, by prioritizing system-level latency minimization, it accelerates demand for advanced packaging, heterogeneous integration, and domestic optical interconnects—boosting China’s Chiplet ecosystem. From a compliance standpoint, Huawei reframes U.S. sanctions as an engineering catalyst, accepting higher R&D costs today to reduce long-term reliance on restricted tools like EUV lithography. TSMC and other Taiwan, China foundries may counter by fast-tracking CoWoS capacity, while NVIDIA could revise its Grace-Hopper roadmap to defend against Huawei’s system-efficiency edge. Within 18 months, China’s IP-core vendors, high-speed SerDes developers, and 3D stacking test equipment suppliers will see surging demand. Globally, the innovation benchmark may shift from transistor density to system协同 efficiency—a new rulebook Huawei aims to author.