Marvell CTO: power and density bottlenecks are driving CPO adoption in AI data centers

Power and density constraints are reshaping the connectivity landscape in AI data centers, with Co-Packaged Optics (CPO) emerging as a critical enabler. Marvell’s CTO highlights that the shift from traditional copper interconnects to silicon photonics is driven by energy efficiency and density demands. This transition will accelerate upstream silicon photonics and optical module development, while forcing downstream server vendors to restructure supply chains. Geopolitical dynamics, especially the U.S.-China tech decoupling, further elevate the strategic importance of CPO self-reliance. Competitors like NVIDIA and AMD may respond with in-house optical interconnect strategies to reduce reliance on third-party suppliers. Over the next 12 months, CPO adoption will accelerate, creating a technology lock-in effect. Leading firms will leverage vertical integration to build competitive moats.