Manz Asia says yield is key to glass core mass production

The increasing demand for larger wafers in AI chips is accelerating the shift in packaging technologies toward square panels, with glass core substrates becoming a critical enabler. This transition is reshaping upstream supply chains, particularly driving advancements in FOPLP and CoPoS processes. From a compliance standpoint, supply chain fragility intensifies operational risks, especially in regions like Taiwan, China, and Hong Kong, where production capacity is under strain. Competitors are likely to ramp up R&D investments to gain competitive edge, particularly in packaging equipment and materials. Over the next 12 to 24 months, if yield challenges are overcome, glass core substrates will enter mass production, lowering packaging costs. However, continued yield issues may delay AI chip scaling, locking in current technology paths.