Major Wall Street banks interpret this year's SEMICON highlights: Advanced packaging is evolving toward 3D system integration, while CPO manufacturing bottlenecks lie in testing. - 富途牛牛

Wall Street banks have analyzed key trends from the recent SEMICON semiconductor exhibition, highlighting that advanced packaging is evolving toward 3D system integration while CPO manufacturing bottl... Read original →

3D system integration is reshaping the semiconductor supply chain, particularly in advanced packaging, where the shift from modular to system-level integration is accelerating. The bottleneck in CPO manufacturing, concentrated in testing, reveals critical shortcomings in optical-electronic integration verification, directly impacting production efficiency and highlighting the extreme precision demands of nanoscale fabrication. Wall Street analysts note that this trend forces test methodologies to evolve rapidly, especially in wafer-level and photonic device validation. Companies unable to overcome these testing constraints face yield degradation and delivery delays. In the next 12 months, investment in test equipment and processes will be decisive for packaging firms. Amid global supply chain realignment, localization and standardization of testing capabilities are becoming strategic priorities. The industry is transitioning from isolated breakthroughs to integrated system performance, with test capability emerging as a critical bottleneck for sustained growth.