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This report analyzes the latest developments in the semiconductor industry. From a technological perspective, 3nm process technology has become the industry standard, while continued breakthroughs in ... Read original →

The mainstream adoption of 3nm is triggering a cascade across the tech stack: escalating EUV layer counts intensify yield challenges, forcing co-optimization in EDA, mask design, and advanced packaging. TSMC’s CoWoS dominance locks in NVIDIA’s AI chips, creating a performance moat beyond mere fabrication. Geopolitical subsidies inflate costs as talent and equipment shortages undermine local fab viability. Under U.S. CHIPS and EU Chips Act pressures, Samsung may retreat from logic foundry to focus on memory convergence. Within 18 months, leading-edge capacity will concentrate in Taiwan and Arizona, while Chinese players—blocked from advanced tools—will pivot aggressively to chiplet-based heterogeneous integration. This isn’t just a technical workaround; it’s the early signal of a fractured global semiconductor order.