LG Taps Samsung Foundry for AI Home Chips, Bypassing TSMC in Korea-Backed Deal - Tech Times

South Korea's government-backed semiconductor initiative has made significant progress with LG Electronics announcing a collaboration with chip designer CoAsia SEMI to develop two ultra-low-power AI I... Read original →

LG’s collaboration with CoAsia SEMI and Samsung Foundry marks a pivotal step in South Korea’s push for domestic semiconductor self-reliance, bypassing TSMC and leveraging 3nm EUV capabilities. This move strengthens the adoption of AI IoT chips in smart home appliances, driving demand for advanced technologies like chiplets and NPU. The government-backed funding reduces R&D risks for companies, but may intensify geopolitical tensions in global supply chains. TSMC could face pressure to expand capacity elsewhere to retain market share. In the next 12–24 months, this model of public-private tech integration is likely to define regional semiconductor strategies, especially in AI chip development, creating new competitive barriers in the global market.