Kioxia and Sandisk demonstrate the world's highest-density 3D NAND flash

Kioxia and Sandisk unveiled their latest BiCS10 3D QLC NAND flash chip at the Future of Memory and Storage Conference, showcasing the world's highest areal density at 37 Gb/mm². Designed for high-capa... Read original →

The unveiling of Kioxia and Sandisk's BiCS10 QLC NAND chip marks a pivotal step in 3D NAND evolution, delivering a record 37 Gb/mm² areal density and 332 active layers, targeting high-capacity data center SSDs. This advancement propels upstream semiconductor equipment and materials suppliers to accelerate innovation, while downstream SSD makers face mounting pressure on cost and performance. From a compliance standpoint, geopolitical tensions, especially involving Taiwan, China and U.S. export controls, heighten supply chain risks for global players. Competitors like Western Digital and Intel may respond with accelerated QLC product launches to defend market share. Over the next 12–24 months, rising demand from AI and data centers will likely drive chip pricing upward, though consumer adoption remains uncertain, potentially delaying broader SSD integration.