Jun Young-hyun, Jensen Huang deepen Korea-Nvidia ties on HBM and foundry - CHOSUNBIZ - Chosunbiz

Recent discussions between Jun Young-hyun, Vice Chairman of Samsung Electronics, and Jensen Huang, CEO of NVIDIA, highlight deepening cooperation in the semiconductor sector, particularly in HBM (High... Read original →

The deepening Samsung-NVIDIA alliance on HBM4 and beyond accelerates the industry’s shift toward memory-compute co-design, pressuring rivals like TSMC and SK hynix to align CoWoS packaging with next-gen HBM interfaces. Potential U.S. export controls on advanced packaging could raise compliance costs for Samsung’s non-U.S. clients, though its dual production in Korea and Xi’an mitigates supply chain exposure. In response, TSMC may fast-track its SoIC-HBM integration, while Micron could leverage cloud partnerships with Microsoft and Amazon to gain traction. Within 18 months, HBM5 prototyping will be pivotal: if Samsung achieves first-mover volume production, it not only secures NVIDIA’s Blackwell Ultra ramp but also redefines pricing power in the AI datacenter memory ecosystem.