Jensen Huang thinks China will develop its own advanced lithography chipmaking tools by 2030

NVIDIA CEO Jensen Huang believes China will develop its own advanced lithography equipment by 2030, despite significant challenges in the semiconductor industry. While China has made notable progress ... Read original →

Jensen Huang’s forecast underscores China’s strategic ambition in advanced lithography, despite persistent technical hurdles. While SMEE has made strides in ArF scanners, EUV remains out of reach, highlighting the deep complexity of equipment manufacturing. NVIDIA’s AI growth hinges on access to leading-edge fabrication, which China currently lacks. ASML and other Western suppliers face increasing export restrictions, tightening global supply chains and accelerating China’s push for self-reliance. In the short term, TSMC and its partners may delay competitive pressure through licensing or collaboration, but long-term shifts in global semiconductor dynamics are inevitable. Over the next 12–24 months, China’s AI chip investments will intensify demand for high-end lithography tools, yet real breakthroughs remain constrained by both technical and geopolitical barriers.