JCET profit surges 79% on AI demand, with advanced packaging and CPO gaining scale

JCET’s robust performance reflects the explosive growth in AI infrastructure demand, directly accelerating its advanced packaging transition. Upstream, this drives increased capacity for HDI and silicon interposers; midstream, packaging firms expand CPO module capabilities; downstream, AI chip and server vendors face higher integration demands. From a policy standpoint, U.S. export controls intensify supply chain reshoring pressures, especially in critical materials and equipment. Competitors like Amkor and SMIC may pursue M&A to scale up. Over the next 12–24 months, sustained AI server demand will boost advanced packaging adoption, with CPO emerging as a key growth engine. The synergy between Taiwan, China and Hong Kong, China will become increasingly pivotal in shaping global semiconductor supply chains.