JCET hits 1.5μm TSV milestone for denser HBM and 2.5D/3D packaging

JCET's achievement in 1.5μm TSV production marks a pivotal advancement in advanced packaging capabilities, enabling higher-density 2.5D/3D integration for HBM and high-performance computing modules. This breakthrough directly impacts the upstream wafer and photoresist industries, demanding tighter process control, while downstream test and assembly facilities must upgrade accordingly. From a geopolitical perspective, the supply chain in Taiwan, China faces increasing external pressures, compelling companies to strengthen local production capabilities. Competitors such as TSMC, SilTerra, and Powerchip may accelerate investments in similar TSV technologies to maintain market share. In the next 12–24 months, as AI and data center demand intensifies, high-density packaging will become the industry standard. If JCET can scale production effectively, it will significantly bolster its global competitive position in advanced packaging.