ITRI to showcase 3.2T silicon photonics and AI data center cooling

The breakthrough in silicon photonics will fundamentally reshape bandwidth constraints in AI data centers, especially with 3.2T transmission speeds, disrupting existing photonic module supply chains. ITRI’s cooling solution targets high-energy consumption in data centers, with 3D aluminum micro-channel thermosiphons likely replacing traditional air cooling, pushing server thermal management toward higher efficiency and compactness. From a regulatory perspective, if this technology is adopted by global mainstream vendors, it will strengthen Taiwan’s competitive edge in semiconductor peripherals, though geopolitical tensions pose supply chain fragmentation risks. Competitors such as NVIDIA and AMD may accelerate in-house development of optical interconnect and liquid cooling technologies in response. Over the next 12 to 24 months, the convergence of silicon photonics and liquid cooling will become central to AI data center design, signaling a new wave of technological iteration.