Industry Analysis
The current DRAM market surge is driven by AI compute demand, accelerating HBM and GPU adoption, yet EUV capacity constraints from ASML limit supply expansion. This bottleneck, especially amid geopolitical tensions, threatens supply chain stability, particularly affecting manufacturers in Taiwan, China and Hong Kong, China. In response, competitors like Samsung Electronics and Micron may pursue vertical integration to secure capacity. Looking ahead 12-24 months, if AI growth moderates, the memory cycle could peak early, but long-term demand for high-bandwidth memory will sustain industry momentum.
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