Interview with Chris Miller: Moving Past HBM, to the Next AI Memory Frontier - v.daum.net

The semiconductor industry is undergoing a structural transformation driven by the AI revolution. In an interview with Kyunghyang Daily News, Chris Miller emphasized that South Korean memory giants li... Read original →

The AI-driven memory architecture shift is triggering a technical cascade: while HBM dominates training, inference demands for low-power, high-bandwidth-density DRAM are accelerating Korean giants’ moves into 3D-stacked and near-memory computing. U.S. designations of CXMT and YMTC as 'military-linked' entities have materially increased legal and reputational costs for Western buyers like Apple, forcing supply chains to de-risk from Chinese chips—at a 10–15% global cost premium. Samsung and SK Hynix are leveraging their $580B cluster investment to secure equipment and materials priority, while Micron bets on CXL-based ecosystems. Chinese firms may exploit the next downturn with state-backed capacity expansion. Over the next 12–24 months, a ‘false boom’ will unravel—HBM overcapacity will coexist with shortages in inference-optimized memory. Winners will be those integrating process scaling, advanced packaging, and system-level optimization into a unified stack.