Intel EMIB yields hit target, MediaTek eyes 2028 ASIC ramp

MediaTek's confirmation that its second-generation data center ASIC will ramp in 2028, with Intel's EMIB process achieving target yields, marks a significant technical milestone. This advancement will pressure upstream foundries and packaging vendors to scale up advanced packaging capacity, intensifying competition among TSMC, Intel, and Samsung. From a compliance standpoint, ongoing U.S.-China tech decoupling may restrict EMIB technology exports, compelling MediaTek to accelerate localization strategies and enhance supply chain resilience. Competitors like AMD and NVIDIA may expedite their own ASIC roadmaps to maintain market share. Over the next 12–24 months, as AI compute demand surges, packaging technologies will become a critical bottleneck, reshaping global chip supply chains with EMIB's maturation at the center of this shift.