India’s OSAT-ATMP Build-Out: From Legacy Packages to 2.5D

India is rapidly advancing its semiconductor packaging capabilities, particularly in advanced packaging technologies. ASIP Technologies, in collaboration with South Korean partner APACT, has initiated... Read original →

India's rapid advancement in semiconductor packaging is reshaping global supply chains. The joint venture between ASIP and APACT in Visakhapatnam signals a strategic shift from legacy BGA and wire-bond to 2.5D packaging, directly enabling domestic production of DRAM, multi-die stacking, and SiP technologies. This move bolsters India's competitiveness in power devices and automotive applications, pressuring South Korean, Japanese, and Taiwanese OSATs to accelerate local investments. While the 50% capital subsidy reduces entry barriers, long-term risks include talent and equipment supply gaps, potentially creating tech dependency. Global players like Micron and Renesas may deepen partnerships with Indian firms to secure market access in smart devices and EVs. In the short term, this development intensifies global packaging capacity competition, while in the medium term, it could trigger a reconfiguration of technical standards and regional production divisions.