India likely to focus on legacy chip fabs, advanced packaging under Semicon 2.0: ISM CEO - Moneycontrol.com

India's Semicon 2.0 initiative represents a strategic shift in the global semiconductor landscape, with the country focusing on legacy chip fabs and advanced packaging technologies. This approach refl... Read original →

India's strategic pivot toward legacy fab and advanced packaging under Semicon 2.0 signals a shift from manufacturing mimicry to value chain upgrading. This move will catalyze upstream supply chains and accelerate midstream packaging capabilities. From a compliance standpoint, it enhances supply chain resilience but introduces risks tied to capital intensity and talent gaps. In the competitive landscape, as US-China semiconductor rivalry intensifies, India’s potential to attract foreign investment and localize key processes could reshape regional manufacturing dynamics. Over the next 12–24 months, if India successfully secures technology partnerships and builds critical process nodes, its emergence in advanced packaging may significantly alter global semiconductor supply chain structures.