IBM Unveils World's First Sub-1nm Semiconductor Technology - 조선일보

IBM unveiled the world's first sub-1 nanometer semiconductor process technology on June 25, 2026, marking a significant leap in chip manufacturing. The technology employs an innovative 'nanostack' arc... Read original →

IBM’s sub-1nm breakthrough, anchored in its 'nanostack' 3D architecture, will force rapid upgrades across EDA, photoresist materials, and advanced packaging ecosystems. The 70% power efficiency gain reshapes AI chip design paradigms, pressuring TSMC (Taiwan, China) and Samsung to accelerate 3D DRAM integration. Geopolitically, the IBM-Rapidus alliance is a deliberate workaround to U.S. export controls on EUV tools—but yield ramp costs may spiral. Intel could leverage this to deepen ties with U.S. microelectronics initiatives, while SMIC faces heightened equipment blockade risks. Though commercialization remains distant, the announcement will likely trigger new state subsidies for domestic fabs over the next 18 months, accelerating global supply chain fragmentation.