Huang warns of chip shortage as Chey vows to double production - Communications Today

At the GTC 2026 conference in Taipei on June 2, 2026, NVIDIA CEO Jensen Huang warned that global semiconductor shortages will persist in the near term, despite full mobilization of supply chains. As A... Read original →

Jensen Huang’s warning at GTC 2026 in Taipei, China signals a structural shift: agentic AI demands memory systems that outpace current DRAM scaling. SK Group’s unprecedented pledge to double wafer output is a defensive play against surging HBM4/5 and CoWoS packaging bottlenecks. Technically, this forces tighter co-design between logic and memory, accelerating TSMC and Samsung’s 2.5D/3D integration roadmaps. Geopolitically, the deepening U.S.-ROK semiconductor alliance raises compliance barriers for non-aligned players—especially Chinese memory makers facing secondary containment. Intel and Micron may rush HBM partnerships, while YMTC could exploit cost advantages in edge AI. Over the next 18 months, the industry will enter a 'capacity commitment race': capex soars but output lags, keeping AI chip prices elevated and entrenching dominance among top-tier players.