HBM: Record quarterly sales and market share gains, with stable EBIT amid ongoing margin pressures - TradingView

HBM (High Bandwidth Memory) market demonstrated strong growth in the quarter, achieving record sales performance while gaining significant market share. This expansion is primarily driven by sustained... Read original →

Record HBM sales reflect AI's insatiable demand for memory bandwidth, triggering a cascade across the tech stack: TSV and CoWoS advanced packaging capacities are being stretched, while EUV adoption in memory manufacturing accelerates—reshaping value distribution from materials to OSATs. Geopolitically, U.S. export controls on advanced tools compel Korean and Taiwan, China-based suppliers to build costly redundant local supply chains, inflating CapEx. In the competitive arena, SK hynix leads technically, but Samsung leverages vertical integration to aggressively push HBM3E, while Micron bets on hybrid bonding for a leapfrog. Over the next 12–24 months, HBM will shift from an AI premium component to a compute infrastructure baseline; its yield ramp rate and per-GB cost trajectory will dictate data center TCO and widen the performance gap between tier-one and lagging memory vendors.