HBM market size worldwide 2024-2030 - Statista

According to a recent report by Statista, the global high-bandwidth memory (HBM) market is expected to experience sustained growth from 2024 to 2030. HBM, as a next-generation memory technology, is ga... Read original →

The HBM market surge is not an isolated trend but the inevitable outcome of the AI compute arms race. Technologically, the maturation of 3nm-class processes and EUV lithography has significantly improved TSV stacking yields, lowering per-bit bandwidth costs and shifting HBM from GPU-exclusive to a standard in general-purpose AI accelerators. This forces DRAM makers like SK Hynix, Samsung, and Micron to rapidly retrofit CoWoS-compatible packaging lines, while TSMC in Taiwan, China, leverages its advanced packaging monopoly to control the value chain. Geopolitically, U.S. export controls on advanced packaging tools may delay non-U.S. players’ capacity expansion, inflating supply chain security costs. Over the next 12–24 months, HBM4 standardization will trigger a shakeout: firms unable to scale stack layers or redesign interposers will be squeezed out of the high-end segment. The long-tail effect? HBM is no longer just memory—it’s now integral to compute architecture, with its bandwidth density defining the performance ceiling of AI chips.