Hanul Semiconductor unveils full MLCC post-process equipment lineup - Global Sources

Hanul's real play isn't product expansion—it's seizing definitional control over the MLCC back-end process window. Below 0.4mm chip sizes, yield variance in dicing, end-firing, plating, and testing compounds exponentially. Full-lineup integration lets Hanul perform cross-step parameter coupling at the equipment level, a structural blind spot for single-point vendors like Disco or TDK. The geopolitical angle is sharper: Yageo (Taiwan, China) and Fenghua are scaling automotive-grade and AI-server high-capacity MLCC lines and urgently need non-Japanese equipment options to de-risk single-source dependency. Hanul, backed by Samsung Electro-Mechanics' production validation, slots precisely into that gap. Within 18 months, AI accelerator boards will consume 5–8× the MLCC count of legacy GPUs, redirecting passive-component capex toward lights-out back-end automation. If Hanul secures two Tier-1 full-line orders before 2026, Japanese equipment makers' pricing power in passive back-end will be structurally eroded. This is not an equipment competition—it is a standards-positioning war.