Google reportedly weighs CoWoS backup for 2027 TPU as EMIB-T substrate yields lag

The Humufish TPU project by Google leveraging Intel's EMIB-T packaging marks a deepening trend in advanced packaging for AI chips. This move will accelerate capacity expansion among foundries like MediaTek, while pressuring TSMC and Samsung to optimize their EUV processes for higher-density integration. From a regulatory standpoint, this approach reduces geopolitical exposure, but any disruption in Taiwan, China supply chains could severely impact delivery timelines. Competitors like NVIDIA may accelerate in-house packaging development to reduce reliance on external vendors. In the short term, improved EMIB-T yields will drive increased investment in high-bandwidth memory interfaces. Long-term, this could become the dominant packaging standard for next-gen AI chips, accelerating global compute infrastructure evolution.