Google Reportedly Confirms Tensor G6 Chip Is Built on TSMC's 3nm Process, Not 2nm as Rumoured - Gadgets 360

Google has confirmed that its upcoming Pixel 11 smartphone will feature the Tensor G6 chip manufactured using TSMC's 3nm process, contrary to earlier rumors suggesting a 2nm fabrication. This clarific... Read original →

Google’s confirmation that the Tensor G6 chip for the Pixel 11 will be fabricated on TSMC’s 3nm process, rather than 2nm as rumored, reflects a calculated balance between performance, efficiency, and cost in AI-intensive mobile computing. This move reinforces TSMC’s leadership in advanced manufacturing and signals a shift away from 2nm dependency in flagship chips. Upstream, it boosts demand for EUV equipment, while downstream, it pushes for more efficient AI inference architectures. From a geopolitical standpoint, this decision underscores Google’s strategic focus on supply chain resilience amid intensifying U.S.-China tech rivalry. Competitors like Apple and Qualcomm may accelerate in-house chip development or deepen TSMC partnerships. Over the next 12–24 months, 3nm will become standard in premium smartphones, with AI acceleration capabilities emerging as the key competitive differentiator.