Global DRAM and HBM Market Share: Quarterly - Counterpoint Research

Counterpoint Research's quarterly report on global DRAM and HBM market share provides comprehensive insights into the rapidly evolving memory industry dynamics. The report features a unique 3-dimensio... Read original →

The AI compute arms race is thrusting HBM into the memory mainstream, forcing DRAM makers to pivot from commodity volumes to high-bandwidth, 3D-stacked architectures. Upstream, equipment vendors like ASML and Applied Materials face surging demand for EUV and TSV tools, while downstream GPU designers must overhaul memory subsystems to harness HBM3e/4 IO density—this is architectural rupture, not incremental upgrade. Geopolitically, tightening U.S.-South Korea controls on advanced packaging will raise compliance costs for foundries in Taiwan, China and mainland China, risking regional supply imbalances. Samsung, SK hynix, and Micron are locking in NVIDIA and AMD through co-development deals to secure HBM capacity for the next 18 months; CXMT risks exclusion from the high-end chain if TSV yield hurdles persist. Over the next two years, HBM will evolve from a peripheral component to the performance ceiling of AI chips, with its concentrated production potentially becoming a new chokepoint rivaling logic-node dependencies.