Fulltech sees low DK2 shipments rising, starts M9 quartz cloth certification

Fulltech’s ramp-up of low-DK2 shipments signals intensifying demand for high-frequency PCB substrates driven by next-gen AI servers. Technically, this forces upstream resin formulators and glass-weave suppliers to co-optimize materials, while PCB fabricators must recalibrate lamination processes. Compliance risks loom if M9 quartz cloth certification relies on U.S. or Japanese-controlled inputs, potentially triggering export control bottlenecks and higher redundancy costs. Competitors like Nittobo and AGY may accelerate localized capacity to capture premium segments. Over the next 18 months, as CoWoS-L and silicon photonics gain traction, ultra-low DK materials will shift from optional to mandatory—Fulltech stands to secure structural leverage ahead of HBM5 adoption if it anchors partnerships with Taiwan, China-based PCB makers embedded in TSMC’s advanced packaging ecosystem.