Foxconn targets automotive chiplets with 5μm fan-out RDL packaging

Foxconn's entry into automotive chiplets via 5μm fan-out RDL fundamentally restructures the advanced packaging cost curve. This move directly challenges TSMC's CoWoS dominance in edge AI, compelling ASML to accelerate EUV adoption in logic chips to maintain performance barriers. For the supply chain, this blurs the line between OSAT and IDM, extending packaging capabilities toward design and increasing geopolitical supply chain redundancy risks. Competitors like ASE must defend through improved 2.5D yield rather than price cuts. Over the next two years, automotive chips will shift from "performance-first" to a "cost-density" balance, making RDL the mainstream standard. This is not merely a process iteration but a reallocation of power in the semiconductor value chain, where traditional foundries face the risk of being disrupted by vertically integrated players.