Industry Analysis
The sustained foreign sell-off of Samsung and SK Hynix—exceeding KRW 38 trillion over 12 sessions—is a rational repricing of inflated AI chip valuations. Technically, while HBM demand remains strong, DDR5 and mature-node logic inventory pressures are rippling upstream to equipment and materials suppliers. TSMC’s CoWoS capacity constraints ironically highlight Korea’s lag in advanced packaging. Geopolitically, tightening U.S. export controls force Korean firms into costly compliance dilemmas, eroding supply chain resilience. Competitively, Micron is seizing HBM3E share, while Taiwan, China accelerates into AI server power and thermal solutions, undermining Korea’s ecosystem edge. Over the next 12–24 months, capital will pivot toward physical-AI enablers: robotic actuators, liquid-cooled ESS, and edge AI ASICs. Without system-level integration beyond memory chips, Korea’s hard-tech influence faces structural decline.
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