Exclusive: The semiconductor battle behind AI data centers and EVs - digitimes

Behind the rapid expansion of AI infrastructure and electric vehicles, a quiet battle is unfolding in the semiconductor supply chain. This competition encompasses not only technological breakthroughs ... Read original →

The tight integration of 3nm processes and EUV lithography is forcing a full-stack upgrade across EDA tools, advanced packaging, and thermal solutions—AI chip power density now exceeds conventional server infrastructure limits. TSMC (Taiwan, China), leveraging superior yields, has secured NVIDIA’s next-gen Blackwell Ultra orders, yet U.S. CHIPS Act stipulations are inflating its Arizona fab operating costs by over 15%, deepening supply chain fragmentation. Samsung and Intel will likely accelerate their 2nm roadmaps to capture HPC clients, while SMIC remains constrained by EUV export controls. Over the next 18 months, AI data centers will shift from raw performance races to system-level energy efficiency battles, and automotive SoCs face delayed deployments due to extended ISO 26262 certification cycles. National self-reliance policies may spur short-term capex but risk long-term overcapacity and fragmented technical standards.