Exclusive: Rapidus links 2nm chips, HBM and advanced packaging in AI foundry strategy - digitimes

Japanese chipmaker Rapidus is integrating its 2nm chip technology with high-bandwidth memory (HBM) and advanced packaging as a core component of its AI-focused foundry strategy. This move underscores ... Read original →

Integrating 2nm process, HBM, and advanced packaging into its AI chip strategy, Rapidus is not only enhancing performance and efficiency but also signaling a strong push towards establishing a comprehensive semiconductor value chain. Technically, this drives innovation across the entire stack from materials to design and testing. On the compliance and risk front, as countries like the US, Japan, and South Korea increasingly focus on securing their semiconductor supply chains, Rapidus's localization efforts may reduce dependency risks, albeit at the cost of potentially significant R&D expenditures. In terms of market dynamics, competitors like TSMC and NVIDIA are likely to accelerate their own next-gen process and heterogeneous integration strategies to maintain their edge. Over the next 12-24 months, with the expanding scope of AI applications, demand for such highly integrated solutions is expected to rise, creating new growth opportunities within the industry.