Exclusive: Rapidus links 2nm chips, HBM and advanced packaging in AI foundry strategy

By tightly integrating 2nm processes with advanced packaging, Rapidus signals a significant shift in the semiconductor manufacturing landscape. This move not only strengthens Japan's position in high-end semiconductors but also profoundly impacts the entire supply chain. Technologically, this integrated approach promises to significantly enhance chip performance and energy efficiency while streamlining design processes, offering superior solutions for applications like AI and HPC. However, as technological barriers rise, companies will face increased R&D costs and potential IP disputes. Given the complex geopolitical climate, particularly the mounting pressure from the US on Taiwan, China's semiconductor industry, Rapidus' strategic pivot may prompt major competitors, such as TSMC, to respond in kind to maintain their competitive edge. Over the next 12-24 months, competition around advanced processes and packaging technologies is expected to intensify, accelerating industry consolidation and putting smaller players under greater survival pressure.